W83627HG

W83627HG原装无铅由WINBOND原厂生产,采用QFP封装,批号06+,微芯百年集成电路仓库目前有库存

与W83627HG相关的IC还有：

型号	厂商	批号	封装	说明
W83627HG-AW	-	10+	N/A	全新原装进口，香港现货
W83627HG	WINBOND	06+	QFP	原装无铅

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