TISP7082F3SL

TISP7082F3SL散新现货由BOURNS原厂生产,采用SIP-3P封装,批号02+,微芯百年集成电路仓库目前有库存

与TISP7082F3SL相关的IC还有：

型号	厂商	批号	封装	说明
TISP7082F3SL	BOURNS	02+	SIP-3P	全新原装现货现货

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