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FI-XB30SSL-HF15-R2500
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FI-XB30SSL-HF15-R2500

  • 所属类别：编程器BIOS芯片
  • 产品名称：
  • 厂商：SONY
  • 生产批号：02+
  • 封装：DIP
  • 库存状态：有库存
  • 库存量：0
  • 最低订购量：
  • 详细资料：点击查找FI-XB30SSL-HF15-R2500的pdf资料
  • 点击询价
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  • 产品介绍

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AD5668BCPZ-2500RL7 ADI15+16 ld LFCSP 4x48通道、16位、SPI电压输出denseDAC，集成5 ppm/°C片内基准电压源
AD5662BRJZ-2500RL7 ADI15+8 ld SOT-232.7-5.5V、16位nanoDAC®转换器，采用SOT-23封装
AD5662ARJ-2500RL7 ADI15+8 ld SOT-232.7-5.5V、16位nanoDAC®转换器，采用SOT-23封装
AD5061BRJZ-2500RL7 ADI15+8 ld SOT-232.7 V至5.5 V、全精度、16位VOUT nanoDAC®转换器，无缓冲，采用SOT 23封装
AD5062BRJZ-2500RL7 ADI15+8 ld SOT-232.7 V至5.5 V、全精度、16位VOUT nanoDAC®转换器，无缓冲，采用SOT 23封装
AD5602YKSZ-2500RL7 ADI15+LFCSP62.7 V至5.5 V、小于100 nano A、12位nano DAC®数模转换器，内置I2C兼容型接口，采用SC70小型封装
AD5602BKSZ-2500RL7 ADI15+LFCSP62.7 V至5.5 V、小于100 nano A、12位nano DAC®数模转换器，内置I2C兼容型接口，采用SC70小型封装
AD5612YKSZ-2500RL7 ADI15+LFCSP62.7 V至5.5 V、小于100 nano A、12位nano DAC®数模转换器，内置I2C兼容型接口，采用SC70小型封装
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